Global ABF Substrate (FC-BGA) Market Anticipated to Surpass US$ 9.33 Billion by 2029

Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

This report studies the FC BGA substrate, also called ABF (Ajinomoto Build-up Film) substrates, which are IC Substrates made of Ajinomoto Build-up Film.

The ABF (Ajinomoto Build-up Film) substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

According to the new market research report “Global ABF Substrate (FC-BGA) Market Report 2023-2029”, published by QYResearch, the global ABF Substrate (FC-BGA) market size is projected to reach USD 9.33 billion by 2029, at a CAGR of 6.9% during the forecast period.

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PCBs are key component of various electronic products. They are used in computers, communications, and various consumer electronic products and equipment. In recent years, they have been widely used in the automotive, industrial, medical, military and aerospace industries. Therefore, the development of this industry is driven by the advancement of modern science and technology, and is closely related to the demand of various end products.

The global key manufacturers of ABF Substrate include: Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2022, the global top five players had a share approximately 75% in terms of revenue.

Asia (excluding China) is the largest market, holds a share about 58%, key consumers in Asia are Chinese Taiwan, South Korea, Japan and Southeast Asia.

In terms of products, 4-8 Layers ABF substrates are the most common used products, due to the strong demand from PC. In next few years, the segment over 10 layers ABF substrate will be widely used, driven by the demand of AI, HPC, and 5G.

Key end users are Intel, AMD, Nvidia, Apple, and Samsung, etc. In 2022, the key end users are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025. Almost all of ABF substrates manufacturers have plans to expand production capacity in next few years, and there also several companies have planned to enter to produce ABF substrates, such as Shenzhen Fastprint Circuit Tech, etc. The global competitive situation will be totally different after two or five years, filled with uncertainty.

Key Market Insights:

1. Market Expansion: The global ABF Substrate (FC-BGA) market is witnessing significant expansion, primarily driven by the increasing demand for advanced semiconductor packaging solutions in consumer electronics, automotive, and industrial sectors. As technology continues to advance, the market is expected to grow at a steady pace.

2. Technological Advancements: The market is marked by continuous technological advancements, with manufacturers focusing on developing ABF substrates that offer enhanced electrical and thermal performance. These advancements aim to address the evolving needs of high-performance electronic devices.

3. Growth in 5G Technology: The rapid deployment of 5G technology is fueling the demand for ABF substrates, which are crucial components for 5G infrastructure and mobile devices. This growth is expected to continue as 5G networks expand globally.

4. Miniaturization and Integration: The trend of miniaturization and integration in electronic devices is driving the need for smaller, more efficient ABF substrates. Market players are responding by developing compact and high-density substrates.

5. Sustainability Initiatives: With growing environmental concerns, many companies in the ABF substrate market are focusing on sustainable manufacturing processes and materials. This is expected to influence purchasing decisions and promote eco-friendly practices.

6. Market Players: Key players in the global ABF Substrate (FC-BGA) market which are actively investing in research and development, collaborations, and acquisitions to maintain a competitive edge.

7. Regional Dynamics: The market growth is not uniform across regions, with Asia-Pacific leading the way due to its dominant role in electronics manufacturing. North America and Europe also continue to play significant roles in the market.

For more information, or to purchase the report, please visit: https://www.qyresearch.com/reports/459120/abf-substrate--fc-bga

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